AI Factories Engineered for Density and Performance
50–140 kW per rack; up to 150 kW Peak load. Designed to go up to 300 kW making it Future ready.
0.5–5 MW per module within a compact footprint, with built-in scalability.
16 to 36 weeks from design agreement to RFS.
Tier III-ready, vendor-agnostic, globally compatible. With Option for a non-critical setup.
Direct-to-Chip Liquid Cooling (DLC)
- Cold plate loops mounted directly to GPU/CPU dies
- Supports thermal loads >100 kW per rack
- Low Delta T and thermal resistance, ensuring minimal energy loss
- Circulated via cooling distribution units (CDUs)
Rear Door Heat Exchangers (RDHx)
- Rack-mounted liquid-to-air exchangers
- Removes the 5- 20% residual heat post-DLC
- Passive/active failover to ensure thermal protection during component failure
Chiller/Drycooler Strategy
- Hybrid N+1 architecture (chillers + drycoolers)
- Grundfos VFD pumps ensure stable flow and hydraulic balance
- Adiabatic option: Enables PUE reduction in moderate climates
This is our base model, engineered to deliver up to 5 MW of compute power. It supports up to 36 air-cooled 19-inch racks, all equipped with high-efficiency Rear Door Heat Exchangers to ensure optimal thermal management. All of this starting from a 416m² footprint (32-13m)
Built to meet Tier III standards, this model offers exceptional reliability and uptime and can be upgraded to Tier IV for even greater fault tolerance and resilience.
Designed with scalability in mind, it enables seamless, uninterrupted expansion as your needs grow, forming the foundation for a 20 MW+ AI campus.
- Standard: Build to a TIER III/IV design
- Modular Architecture: Scalable from 1 MW to 20 MW
- Rack Capacity: 26–36 racks per module
- Power System: Dual scalable power pods (A & B feeds), UPS- backed
- Fire Protection: Argonite-based detection and suppression
- Purpose: Rapid, turnkey AI infrastructure with integrated compute
- Deployment Time: 24 weeks
Our Modular Rooms offer scalable AI infrastructure with unlimited space flexibility, engineered to accommodate projects of any size and diverse use cases. While optimized for indoor deployment, these solutions can be adapted to virtually any environment.
Our modular units are pre-fabricated at our manufacturing facility, with final assembly and installation completed on-site by our certified technical teams. The modular design enables unlimited configuration possibilities and is particularly well-suited for countries with strict import regulations, as components are shipped unassembled to reduce costs and simplify customs clearance.
- Concurrent Maintainability: All critical systems (power, cooling, connectivity) can be serviced without downtime.
- Standard: Build to TIER III/IV standard
- Redundancy on Cooling: N+1 or 2N configuration for all vital components.
- Redundancy on Power: 4 makes 3 busbar design (NVIDIA reference design)
- Uptime SLA: 99.999% (5 min 16 sec downtime/year)
- Purpose: Enterprise-grade reliability for mission-critical AI workloads
- Cooling: Liquid-to-chip + RDHx
- Power Capacity: 2.5 MW per unit
- IT space: Modular rooms
- Utility rooms: Containerized Build to the Modflex standard.
- 2.4 MW GB300 NVL72 compute capacity
- Supports 16 DLC racks and 12 air-cooled racks for network and A storage
- Rear Door Heat Exchangers on all racks for efficient cooling
- Built to Tier III/IV
- Seamless scalability to a 20+ MW AI campus
- 7 * 2.4 MW GB300 NVL72 clusters
- A Service corridors on either sides for accessibility and fire systems suppression
- Scalable
- Access control
Scalable AI requires infrastructure engineered from the ground up.